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and support chips fill one end of the board and the relays and transistors fill the rest of the PC board It is important to keep the distances from the receiver to the STAMP 2 and from the receiver to its power source as short as possible When constructing the receiver/controller board, be sure to use IC sockets, in case a board problem ever develops Take care, when installing the ICs, to orient them correctly into the IC socket Every integrated circuit contains either a notch cut into the top or a small circle cut-out on the top left of the IC to indicate the top of the IC There are quite a few diodes on the PC board, so care should be taken to observe polarity when installing them Also be careful when installing the electrolytic capacitors around the MAX232 as well as around the regulator chip.

35.3.2 Galvanic Corrosion and Protection When two dissimilar metals are electrically connected and both are exposed to the same environment, the more active metal will be attacked at a faster rate than if there had been no electrical connection between the two. Similarly, the less active metal will be protected or suffer less attack because the surface areas of both metals can be used to dissipate the electrons generated by oxidation of the more active metal. The net flow of electrons from the more active to the less active metal increases the attack rate of the more active metal and decreases that of the less active metal. An adverse area ratio is characterized by having a larger surface area of less active metal than that of the more active metal. Cracks in a barrier protective coating (i.e., polymers) applied to the more active metal in a galvanic-couple situation can create an extremely adverse area ratio, resulting in rapid localized attack in the cracks. The standard electromotive force (emf) series of metals (Table 35.1) lists

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metals in order of increasing activity, starting with gold (Au), which is the least active. If two of the metals listed were joined in a galvanic couple, the more active one would be attacked and plating or deposition of the less active one would occur. This is based on the fact that solutions contain only unit activity (concentration) of ions of each of the two metals. The standard EMF series is valid only for pure metals at 25 C and in equilibrium with a solution containing unit activity (concentration) of its own ions. If ion concentrations are greater than unit activity, the potentials are more positive; if less, the opposite is true.

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The galvanic series (Table 35.2) shows a similar relationship, except that impure metals such as alloys are also included and the medium is seawater. Other media, other concentrations, and other temperatures can further alter the order of the list. Therefore, care should be exercised in applying these data to a given galvanic corrosion situation except as a general, loose guide.

The LM7805 regulator at U4 provides 5 Vdc to power the receiver and STAMP 2 A 9to 12-V wall wart power supply could be used to power the regulator You will need to create a quarter-wave vertical antenna or a half-wave dipole for the receiver/controller, as you did with the transmitter Be sure to use the same polarization for both antennas If you use a vertical antenna for the transmitter, you must also use a vertical antenna for the receiver Once the main circuit board is completed, be sure to carefully recheck it to ensure correct polarity for the diodes, capacitors, and integrated circuits Once this has been completed, you can make up a programming cable, apply power to the system, and perform a smoke test If everything appears OK, then you can proceed to load the receiver/controller program from your PC into your BASIC STAMP 2.

35.3.3 Passivation Certain common engineering materials, such as iron, nickel, chromium, titanium, and silicon as well as their alloys (i.e., stainless steels), exhibit a characteristic of being able to behave both as a more active and as a less active (passive) material.

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